HomeFresh NewsSJEC successfully Organises Technova 2026 – Final Year B.E Project Exhibition

SJEC successfully Organises Technova 2026 – Final Year B.E Project Exhibition

St Joseph Engineering College (SJEC) successfully organised Technova 2026, its annual final-year B.E. project exhibition, on October 30, 2026. The day-long event showcased over 203+ student projects across eight departments, highlighting innovation,
research and practical engineering solutions.

Coordinated by Ms. Chaitra U.R., Assistant Professor, Department of Electronics and Communication Engineering, the exhibition was inaugurated by Principal Dr. Rio D’Souza, who highlighted the importance of final-year projects in fostering technical skills, creativity
and problem-solving abilities. He also encouraged junior students to explore the exhibits and
gain insights into project development.

A panel of 15 external experts from industry, research organisations and academia, along with internal faculty members, evaluated the projects based on technical quality, originality and presentation. First, Second and Third prizes, along with Innovative Project
Awards, were presented in each department.

The projects addressed real-world challenges in healthcare, agriculture, renewable energy, artificial intelligence, sustainable construction, automation and emerging technologies, reflecting the students’ creativity, teamwork and technical expertise.
As part of its outreach initiative, students from regional schools and Pre-University colleges attending Jnana Sethu 2026 – Science for Peace were also given an opportunity to visit the exhibition and interact with the projects.

In-Charge Director Rev. Fr. Kenneth Rayner Crasta, Chief Administrative Officer Dr. John Edward D’Silva, Principal Dr. Rio D’Souza, Deans and Heads of Departments visited the exhibition and interacted with student teams and evaluators. The successful conduct of
Technova 2026 reaffirmed SJEC’s commitment to innovation-driven education, applied research and practical engineering learning.

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